LONDON, Feb. 28, 2026/ PRNewswire/– Ampace, an international leader in innovative lithium-ion energy storage serving over 75 million users worldwide, will show at Data Centre World London 2026 on 4– 5 March 2026 (Cubicle C145, Excel London). Ampace will display its AI-focused power facilities portfolio, consisting of the PU100 and PU200 systems, strengthening its dedication to the quickly progressing AIDC landscape under its vision of AI connection facilities.
As AI work drive greater rack densities and increased power usage, information centers deal with crucial obstacles in power connection, thermal management, and functional security.
Power Connection Under High-Frequency Load Changes
Fast, massive load variations from AI clusters need systems efficient in instant reaction and smooth functional connection. Ampace’s PU100 and PU200 systems are crafted to soak up unexpected spikes and provide steady energy, guaranteeing constant backup and trusted efficiency in vibrant AI environments.
Thermal Durability for High-Density AI Environments
As GPU heat density increases, standard air cooling is significantly challenged, developing locations, thermal throttling, and greater failure threats. Developed for trusted operation at 30 ° C ambient temperature level, the PU200 supports instant recharge following complete discharge, guaranteeing steady efficiency and thermal dependability for high-density AI environments.
A Dedication to No Security Incidents
Zero-tolerance security is important in AI-driven information centers. Ampace preserves an international release record with absolutely no reported security occurrences. Its PU series integrates extremely steady LFP chemistry, Cell-to-Rack fire defense, and semi-solid cell innovation, lowering thermal runaway threats and gas emissions by approximately 90%, supplying a robust security structure for mission-critical implementations.
At DCW London 2026, Ampace will show that AI Connection Facilities is more than a principle– it is a useful, system-level reaction to the complicated power, thermal, and security obstacles of next-generation AI information centers.
SOURCE Ampace